A New Decade means lots of exciting new technology. In this article, we will have a look at the top 5 upcoming hardware launches from AMD, NVIDIA, and others. Besides, we will also discuss their Key Specifications, Features, and compare them to their previous generations. Some of the information here is based upon leaks, rumors, So we can’t jump to conclusions. Let’s Begin..!

1)Nvidia Ampere RTX 3000 Graphics Cards

Key Features:

  • 4x faster than its predecessor.
  • Utilizes DLSS 3.0.
  • Over 50% increase in performance compared to the last generation.
  • 7nm manufacturing process.
  • RTX 3090: 24 GB GDDR6X, 384-bit memory bus, 350 WūüėĶ
  • RTX 3080 Ti: 11 GB GDDR6X, 352-bit memory bus, 320 W

While several rumors and leaks surfaced over the internet, it seems most of them might turn out to be true. But it‚Äôs too early to jump to conclusions. If these rumors are actually true, it would mean that Nvidia could significantly have an upper hand over AMD. Looking at the specs its obvious that these cards won’t come cheap.

Leaked Renders of Nvidia RTX 3000 Graphics Cards

Checkout this Leaked 3DMark benchmark performance which is 26% faster than the RTX 2080 Ti

2)AMD RDNA 2

AMD RDNA2 is set to be featured on both next gen consoles Xbox Series X and PS5
AMD RDNA2 is set to be featured on both next gen consoles Xbox Series X and PS5

RDNA 2 is the next-generation graphics architecture by Radeon and is set to release in September 2020.

“Development of our RDNA 2 GPUs continues to progress well. We are on track to launch our next-generation gaming GPUs later this year, with a 50% performance per watt increase compared to our current offerings.

AMD’s CEO Lisa Su

HIGHLIGHTS OF RDNA2

  • Hardware Accelerated Raytracing
  • Performance per watt: Increased Clock Speeds, Logic Enhancement, Micro Architecture
  • VRS (Variable Rate Shading)
  • Up to 18% higher transistor density
  • Optimized 7nm process node
Unreal Engine 5 real time demo running on RDNA2 (PS5)

3) AMD ZEN 3 ARCHITECTURE

Aimed for September 2020 release AMD has confirmed that both the new Zen 3 CPUs and RDNA 2 graphics cards are still on track. The AMD Zen 3 architecture is said to be the greatest CPU design since the original Zen. It is a chip that has been completely revamped from the group up and focuses on three key features of which include significant IPC gains, faster clocks, and higher efficiency. Other rumors also suggest a 50% increase in overall floating-point performance.

AMD ZEN 3

Key Features:

  • 8-channel DDR4 memory.
  • Codenames: Vermeer (CPU), Dali (APU w/ IGP), Milan (Server), Grey Hawk (Embedded), Genesis Peak (Threadripper)
  • 20% increase in transistor density, 10% lower power consumption.
  • Backward compatibility: Has AM4 Socket Support.
  • New CPU ARCHITECTURE.
  • 50% increase in overall floating-point performance.

Recently, AMD surpassed its 25√ó20 Energy Efficiency Goal, it proves that they are taking the path of innovation, and it’s quite impressive. It’s no exaggeration to say the¬†future¬†is looking brighter for¬†AMD…!

4)DDR5 System Memory

  • Reduction in power consumption (reduces memory module voltage to 1.1¬†V)
  • Higher Memory Efficiency
  • High Bandwidth ( 3200 – 6400 Mt/s )
Effective Bandwidth comparision between DDR4 and DDR5 (Source : Micron)
Effective Bandwidth: DDR4 vs. DDR5 (Source : Micron)

Usually, Servers get the new memory type first and then the Desktops. DDR5 will probably hit the server space in late Q4 2020 or Q1 2021 before going mainstream. Therefore, 2022/2023 will be the transition phase before it becomes more affordable and widespread.

DDR5 DIMMs will have a 12-V power management IC (PMIC) on DIMM allowing for better granularity of system power loading.
DDR5 DIMM (Source : Micron)

4) PCIe 6.0

Targeted release for 2021, PCIe 6.0 will be fully backward compatible with all previous spec generations.

Two of the key changes that PCIe 6.0 will implement include PAM-4 (Pulse Amplitude Modulation with 4 levels) encoding and low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency.

Key Features :

  • Data rate of 64 GT/s speeds, doubling the 32GT/s data rate of the PCIe 5.0 specification
  • PAM-4 (Pulse Amplitude Modulation with 4 levels) encoding
  • Low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency
  • Backwards compatibility with all previous specification generations

Version 0.5 is considered as the First Draft specification and so it covers all the key aspects of the architecture and includes feedback from interested parties (within PCI-SIG) to version 0.3. Members of the group will be able to add new functionality to the technology at this point.

5) USB 4.0

Firstly, USB 4.0 will be backward compatible with Thunderbolt 3, USB 3.2, USB 2(however, but not via tunneling but instead by dedicated wires). It will operate over the Type-C connector. The first products compatible with USB4 are expected to be Intel’s¬†Tiger Lake¬†series and¬†AMD’s¬†Zen 3¬†series of CPUs, due for release in late 2020.

Key Features Of USB4:

  • 40 Gbps Maximum Speed using two-lane operation.
  • Backward compatible with USB 3.2, USB 2.0, and Thunderbolt 3.
  • Ability to output 16K video at ~80Gb/s with DISPLAYPORT’s ALT MODE.
  • Power Delivery¬†at up to 100 Watts.